ebeam Technologies Sets Start Date for Seminar Series
ebeam Technologies, Flamatt, Switzerland, announced that its international educational seminar series will continue in 2018, kicking off Jan. 25 in Atlanta, Georgia.
The seminar will look at the current state and needs of the flexible packaging market and will include an overview of the latest advancements in low migration ebeam curing along with innovative solutions for flexible consumer product packaging applications.
Printers, packaging printers, converters and finishers will learn about the benefits that ebeam technology can deliver for their businesses from presentations by leading industry experts on photopolymer chemistry and low energy electron beam surface curing technology.
For more information, visit www.ebeamtechnologies.com.