The conference “Semicon Meets Sustainability” on November 5, 2025 will focus on back-end packaging and answering the question of how both energy and resources can be saved. Industry experts will go over new developments and current smart materials and technologies that can help to reduce energy consumption in the future.

The Semicon Meets Sustainability virtual conference, organized by DELO, will take place on November 5, 2024 from 8:00 to 10:15 a.m. (CET) and in a condensed format from 5:00 to 6:40 p.m. (CET). Experts from the adhesive manufacturer as well as renowned industry experts will discuss new developments in sustainable back-end packaging. In addition, smart materials and technologies for photonics integration that can help reduce energy consumption in the future when processing AI-generated data will be highlighted.

For more information, visit www.delo-adhesives.com/semicon-virtual-conference.