Figure 3. Top view (a) and schematic cross-sectional view (b) of a Graphics Processing Unit (GPU). The High Bandwidth Memory (HBM) is stacked vertically and placed in close proximity to the GPU to optimize throughput. 6 The vias appear as vertical lines throughout the interposer which electronically connect the GPU and HBM to the substrate below.

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Figure 8. Toughening materials to improve flexibility and hardness.

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Figure 5. FT-IR spectra for three multi-functional silane precursors

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