Dam Stacking with DELO’s Innovative Encapsulants

DELO, a leading manufacturer of high-tech adhesives and other multifunctional materials for automotive, consumer and industrial electronics applications, introduces an electronic adhesive. It is easy-to-handle and ideal for use on high separating walls between sensors that have little space width and chip encapsulation.

This adhesive has smaller fillers than other products in DELO’s ‘dam-and-fill’ product range, allowing it to be applied with needles as small as 250 µm. The adhesive’s extremely high viscosity provides a high flow resistance and an aspect ratio of 2.5, allowing the height of the adhesive bead to be more than twice its width without collapsing when dispensed.