Sustainability Conference to be Held in Conjunction with SGIA

Hosted by the Sustainable Green Printing Partnership, the 2016 Printing Industry Sustainability Conference will take place Sept. 13 in Las Vegas, Nevada. The 2016 Printing Industry Sustainability Conference is dedicated to showcasing the leading practices and emerging challenges print professionals need to know to enhance sustainability programs. Through a mix of peer-led case studies and roundtable dialogues, this sustainability conference is a unique opportunity to gain actionable insights that can be used to immediately improve performance, identify opportunities for business and set better sustainability goals. RadTech is pleased to be an event sponsor. Information and registration can be found at

RadTech Sets Date for Fall Member Meeting

On Nov. 2-3, RadTech will host its Fall Member Meeting in Austin, Texas. Austin is a major hub of semiconductor, consumer electronics and technology companies, such as 3M, Apple, Hewlett-Packard, Google, AMD, Applied Materials, Cirrus Logic, Cisco Systems, Intel Corporation, National Instruments, Samsung Group, Silicon Laboratories, Oracle Corporation, Hostgator and United Devices. Please plan to join RadTech members as we discuss new initiatives for our industry in UV LED, 3D Printing, Printing & Packaging, Automotive and Education. An EHS meeting also will be held where members will continue the conversation about TSCA Reform and other pressing issues for our industry.

RadTech China Announces Conference Details

Co-organized by RadTech China and Anqing Science and Technology Bureau and Administrative Committee of Anqing Hi-Tech Industrial Development Zone, the 17th RadTech China Annual Conference together with the First Summit Forum on New Chemical Material Industry in Anqing will be held Sept. 7-9 at the Anqing County Garden Phoenix Hotel in Anqing City, Anhui Province, China. RadTech China 2016 will invite government officers, famous scholars and entrepreneurs to share idea and information about industrial policies, frontiers and directions, application achievements, market situations, development trends of UV/EB technology and much more. For more information, visit

Syed Hasan Appointed as Co-Chair to RadTech Editorial Board

Syed Hasan, key account manager for Security Inks, BASF, has been appointed as co-chair to the RadTech Editorial Board, which has oversight responsibilities for UV+EB Technology. Hasan began as a chemist with BASF Coatings in 1989. After completing his MBA, Hasan moved into sales with BASF’s Coating Raw Materials division; he has since held regional and key account management positions for North American and, from January 2013 to May 2016, he managed the new business development and innovation pipeline. Hasan accepted a key account manager role for Security Inks on June 1 reporting into Southfield, Michigan.

ESF Accepting Registration for Short Courses

State University of New York College of Environmental Science and Forestry, Syracuse, New York, has opened registration for two professional development short courses for $295: Principles of Energy Curing Technologies and Basics of UV-Curable 3D Printing. Participants who register prior to Labor Day can receive a special BOGO (Buy One/Get One) deal. Both participants must take the same course. RadTech members also will receive an additional 10 percent discount, and a group discount of 20% off for three or more attendees is available.

In addition, confirmation has been received that the rates for ESF advanced courses will not change next year. The costs for each of the three advanced courses are as follows:

For credit (3 credits per course): $1,359 (NYS residents), $2,775 (out-of-state) per course

Not for credit: $1,359 per course for all (10% discount, $1,223.10, for RadTech members; 20 percent discount, $1,087.20, for groups of three or more non-credit participants from the same organization)

For more information, visit

RadTech Issues Call for Abstracts for uv.eb WEST 2017

Abstracts now are being solicited for the upcoming uv.eb WEST 2017 Materials + Manufacturing Summit, to be held Feb. 27 to March 1 at the Embassy Suites San Francisco Airport Waterfront Hotel in San Francisco, California. A working schedule has been posted to the website to provide suggested conference topic areas, including 3D Printing, Flexible & Printed Electronics, Displays, General Electronics, New Materials, Photoinitiators for UV LED + Advanced Applications, Inkjet/Digital Printing, UV LED, Food Packaging, Food Safety/Disinfection and New Markets/Applications for UV+EB Technology. To submit an abstract for consideration, please email the presentation title and 150-200 word abstract in the body of an email (no attachments please) by Aug. 26 to [email protected].