UV+EB Packaging Conference & Fall Member Meeting
RadTech is proud to announce the UV+EB Packaging Conference, an exciting, one-day conference in Philadelphia set for Tuesday, October 24, 2017. At the conference, RadTech will host presentations on migration, regulatory issues and the latest developments in UV- and EB-curable inks, coatings and adhesives for food and consumer goods packaging. Also, RadTech has announced that the Fall Member Meeting will be the day after the UV+EB Packaging Conference. For additional details and to register, visit www.RadTech.org.
Call for Papers for RadTech 2018: Deadline is Sept. 8
RadTech is pleased to invite the submission of abstracts for RadTech UV+EB Technology Expo and Conference 2018, scheduled for May 7 through 9, 2018, at the Hyatt Regency OHare in Rosemont, Illinois. Individuals interested in presenting a technical conference paper are advised that the presentation should be no longer than 25 minutes, with five additional minutes for Q&A. To request an opportunity to present, fill out the online Abstract Submission Form before September 8, 2017. Details are available at www.RadTech2018.com.
RadTech Returns to Redondo Beach for uv.eb WEST 2019
Following a successful but cold uv.eb WEST 2017 in San Francisco, RadTech has decided to return to Southern California for uv.eb WEST 2019, set to take place March 19 and 20, 2019, at the Crowne Plaza in Redondo Beach, California. The RadTech Annual Winter Meeting is scheduled for March 20 and 21, 2019, at the same hotel. Expect announcements on the program and tabletop exhibition by fall of 2018.
Boyd Joins UV+EB Technology Editorial Board
Darryl A. Boyd, research chemist in the Optical Sciences Division at the US Naval Research Laboratory, Washington, DC, has joined the editorial board of UV+EB Technology. Boyd, who earned a doctorate in inorganic chemistry at Purdue University, currently works to develop chalcogenide-based polymers for use in high-performance optical applications and to chemically modify nanostructured, IR-transmitting substrates to impart such properties as superhydrophobicity. He is principal investigator on a FY2017-2018 grant from the High Energy Laser Joint Technology Office and is included on two patent applications related to his current research.
Call for Papers for 2018 SAE World Congress
Individuals interested in making a technical presentation at the 2018 SAE World Congress, April 10 through 12, 2018, in Detroit, Michigan, are invited to submit abstracts. Mary Ellen Rosenberger of BaySpring Solutions, and Chris Seubert, Ford Motor Company, will again co-chair the session, which is being sponsored by RadTech. Technical papers are being added to submission requests this time, providing additional value for session attendees. Abstracts are due September 1, 2017, and manuscript deadline is October 17, 2017. For more information about submission requirements, see wcx18.org/call-for-papers/.
In Memorium: Rick Sanders
Richard Sanders, Energy Sciences, Inc. (ESI), passed away unexpectedly on June 5, 2017. Ed Maguire, president of ESI, wrote the following: Rick has been a cornerstone of good nature and professionalism at ESI for almost 20 years. He touched so many in such a positive manner. He brought a smile, a charm and a level of comfort to all the worlds he traveled, whether it was in business or playing Santa for youngsters and adults alike or spinning a wood lathe, which he loved, to create art that oozed personal affection. He was special. Rick Sanders was not just a consummate professional but also one of the kindest, most considerate souls I have had the blessing to know.