Nestle Added to RadTech 2018 Programming
UV+EB Technology
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SUBMITTED
RadTech2018 is scheduled for May 7-9 in Chicago, Illinois.
RadTech 2018 to Feature 3D Printing Innovations, RadLaunch Presentations
RadTech, Chevy Chase, Maryland, has announced it will feature 3D printing innovations, breakthroughs and technology previews from new start-ups to established equipment and resin suppliers at RadTech 2018.
RadTech 2018 will feature presentations on 3D printing, including material innovations, new tech, formulation, the use of UV LEDs and hybrid processing. In addition to multiple conference sessions, RadTech 2018 also will feature a panel discussion, including Formlabs and Trio-Labs, that will address the benefits and needs for the continued development of resin 3D printing, including such new materials as ceramics and metal.
The RadTech RadLaunch initiative to support innovators and start-ups also will offer presentations on exciting, unique, next-gen 3D printing, including composites, metals and a foam printing project developed for light-weighting applications in aerospace and automotive.
For more information, visit www.radtech2018.com.
Douglas Copen, senior packaging safety specialist with Nestle, has been added to the conference program at RadTech 2018, which takes place May 7-9 in Chicago, Illinois. Copen will be speaking on Packaging Food Safety Concerns for Inks from a Brand Owner Perspective in a special session taking place Wednesday, May 9.
Also in the session, Lynn Bergeson, of Bergeson & Campbell, will present on What RadTech Members Need to Know about New TSCA, reviewing what has happened, what EPA is poised to do next and what provisions are expected to have the greatest impact on commercial operations. This session will be followed by a special meeting for attendees to discuss possible association initiatives to address new TSCA concerns (please contact RadTechs Gary Cohen at [email protected] for information and if you would like to attend).
A session also has been added to RadTech 2018 conference programming: New Technology Trends. Chaired by Sudhakar Madhusoodhanan and Ashwin Chockalingam of Applied Materials, the session will include Use of High Refractive Index Materials in Display and Lighting Applications (including OLED Displays, HD Displays, OLED lighting and LED lighting); Radiation Cured Parts: Impact of Semiconductor Wafer Cleaning; Development of Functional Films and R2R Processes (for display screens and other applications); and Hydrophilicity Enhancement of UV Cured Acrylic Materials.
RadTech has partnered again with TAGA (Technical Association of the Graphic Arts) for the RadTech 2018 Student Poster Competition, and the association is asking for help in selecting the winner.
Visit this website, and select two posters by Monday, April 30: http://www.radtech2018.com/student-competitions.
RadTech will announce the winners at the awards dinner May 8. The association also will announce winners for Best Paper, Emerging Technologies and RadLaunch.
RadTech 2018 will feature more than 100 presentations and 80 exhibitors. For more information or to sign up, please visit www.radtech2018.com.
