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Evonik Launches TEGO® Wet 288 for Substrate Wetting of Waterborne and Radiation-Curing Formulations

04/14/2025 by sandy

Press release submitted on behalf of Evonik.

Evonik Coating Additives, Essen, Germany, offering a wide range of co-binders for inks and additive for inks, has developed TEGO® Wet 288, a unique substrate wetting additive designed to address the challenges of waterborne and radiation-cured formulations.

Traditional silicone based wetting additives often lose effectiveness in high pH aqueous formulations during long-term storage or negatively impact reprintability and glueability in radiation-cured formulations. TEGO Wet 288 overcomes these limitations.

“We developed this innovative technology through close collaboration with our customers,” said Kai Yang, project manager and head of applied research & technologies Americas INKS at Evonik Coating Additives. “Our TEGO Wet 288 shows a performance profile that was previously thought to be unattainable.”

In waterborne inkjet inks, TEGO Wet 288 significantly reduces surface tension and maintains its effectiveness over extended periods, outperforming competing technologies. In radiation-cured inks and varnishes, it delivers strong surface tension reduction and wetting while preserving reprintability and glueability.

Besides this excellent performance TEGO Wet 288 also provides excellent food contact compliances which allow for the use of this hydrophobic surfactant also in food packaging applications.

Furthermore, TEGO Wet 288 provides broad food contact compliance, making it suitable for use in food packaging applications. This hydrophobic surfactant expands the possibilities for formulators.

“TEGO Wet 288 is the perfect addition to our comprehensive portfolio of solvent-free, high-performance additives for waterborne and UV-cured inks and varnishes, all of which feature broad food contact compliance,” said Susanne Struck, global head of market segment INKS at Evonik Coating Additives.

For more information, visit www.coating-additives.com.

Filed Under: Press Release Tagged With: Enews May 2025

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