Press release submitted on behalf of RadTech Europe.

From sustainability and circularity requirements to food-contact compliance, PPWR implementation, UV LED innovations and evolving market expectations, the challenges facing packaging professionals cannot be addressed in isolation.

That is precisely why RadTech Europe created the RTE Packaging Seminar 2026: a focused event designed to bring together stakeholders from across the entire packaging value chain to exchange perspectives, share expertise and discuss practical solutions.

Our program brings together experts representing multiple perspectives across the packaging ecosystem, including brand owners, converters, packaging producers, formulators, raw material suppliers, regulatory specialists and curing technology experts. Topics include packaging sustainability, food-contact compliance, PPWR, low-migration systems, UV LED and EB curing innovations, and future market developments.

One of the highlights of the seminar will be the participation of Lionel Spack, senior expert Food Contact Materials at Nestlé, who will present on the latest developments in the Nestlé Standard on Printing Inks for Food Packaging. Hearing directly from a leading global brand owner is always highly valued and provides valuable insight into the expectations and requirements shaping today’s packaging supply chain.

The seminar program also includes perspectives from Nestlé, Keller & Heckman, IST INTECH, KNEHO Lacke and Arkema, culminating in an expert panel discussion that brings multiple viewpoints together.

If you work in packaging, inks, coatings, raw materials, food-contact compliance, UV/EB technologies or related fields, this seminar offers a unique opportunity to engage with peers from across the value chain and discuss the future of packaging in Europe.

For more information, visit www.radtech-europe.com/events/rte-seminars/.