From the Editor: February 2020 ENews

Hello, everyone! Can you believe we’re already at the end of February? The weather is sunny and warm – even here in Kansas – and I’m hoping Mother Nature takes it easy on us for the rest of winter.

Here at the UV+EB Technology office, we just sent the first magazine issue of the year off to press, so you’ll be seeing it arriving on your desks in the next week or two. A great magazine depends on great contributors, and we have articles from allnex, Henkel and the US Naval Research Laboratory. Our columnists, Jim Raymont and Byron Christmas, are back with advice on UV cure specifications and understanding the glass transition temperature, and I wrote an article about the outlook for the plastics industry – which our association friends at the Flexible Packaging Association and the Manufacturers Association for Plastics Processors believe is bright.

Now that the magazine is off to press, it’s time for me to focus on conference and tradeshow season! The big one for our industry is – of course – RadTech 2020. UV+EB Technology will be on site in Orlando at Disney’s Coronado Springs Resort, along with around 100 other exhibitors. The folks at RadTech are expecting a big crowd – in fact, I’ve been told registrations are up from the previous event in Chicago.

RadTech 2020 will have more than 100 presentations that focus on all aspects of ultraviolet, electron beam and LED curing technologies. From additive manufacturing to print and packaging to industrial coatings – it’s going to be a fast and furious three days. Make sure you stop by to see me on the event floor!

In this email, you’ll find the announcement of the 2020 Emerging Technology Award Winners. Pepsi is leading the way with the use of electron beam curing technology in flexible packaging applications, a team is championing additive manufacturing as a way to produce temporary tooth replacements in the dental industry, an electron beam grafting method is being used in cataract surgery, and UV curing plays a big role in reducing the size of computer chips in electronics. Read more about these new developments by clicking through.

That’s all for me this time. I hope I see many of you in sunny Florida in a couple of weeks!