Nagase Introduces Epoxy Encapsulation Offerings

Nagase America LLC, New York, New York, now offers a variety of durable encapsulations for automotive electronic applications. Nagase has over 50 years of automotive manufacturing innovation.

Its encapsulations range from potting, underfill and dam/fill, and are specifically engineered to provide advanced resistance to thermal shock, vibrations, moisture and corrosive agents. This allows for the highest-level of protection for the semiconductor chip, solder, wire bonding and other components. The materials are uniquely designed to be customizable based on any application needs.

For more information, visit