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UV+EB Technology

UV+EB Technology

The Official Publication of RadTech North America

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Enews July 2025

Roland DGA Announces the Launch of Two New VersaSTUDIO Desktop Devices

06/16/2025 by sandy

Press release submitted on behalf of Roland DGA. Roland DGA, Irvine, California, a leading provider of large-format inkjet printers, printer/cutters and other innovative devices, has announced the addition of two new printers to its VersaSTUDIO Series of compact, easy-to-use and affordable desktop products – the BN2-30, an eco-solvent printer/cutter with a maximum material … [Read more...] about Roland DGA Announces the Launch of Two New VersaSTUDIO Desktop Devices

UV Days 2025 Sets Standards with Technological Highlights and International Networking

06/16/2025 by sandy

Press release submitted on behalf of IST METZ. Organizer and UV specialist IST METZ, Nürtingen, Germany, a mechanical engineering company that produces systems for curing print and coatings using UV light, can look back on an all-round successful UV Days 2025 event. With around 1,000 visitors from 30 countries and 44 exhibitors, the industry event offered an international … [Read more...] about UV Days 2025 Sets Standards with Technological Highlights and International Networking

Scotty, We Need More Power!

05/29/2025 by becky

Figure 1. Blue Trace data: Collected at 75% power, 8 inches from the cure surface, peak irradiance value just over 400 mW/cm2. Red Trace data: Collected at 100% power, 2 inches from the cure surface, peak irradiance value is just under 800 mW/cm2.

In the original Star Trek television series, Captain Kirk often avoided disaster with the simple command: “Scotty, we need more power!” Star Trek is science fiction (emphasis on fiction), with the original television version set in the 23rd century. Episode after episode, the electrical circuits on the U.S.S. Enterprise managed rapid, large, sustained power surges and spikes to … [Read more...] about Scotty, We Need More Power!

Additive Manufacturing for Electronics Applications

05/29/2025 by becky

Figure 3. Top view (a) and schematic cross-sectional view (b) of a Graphics Processing Unit (GPU). The High Bandwidth Memory (HBM) is stacked vertically and placed in close proximity to the GPU to optimize throughput. 6 The vias appear as vertical lines throughout the interposer which electronically connect the GPU and HBM to the substrate below.

In the preceding column, I compared the feature size and print area of the principal UV vat printing technologies from large to small and their relevance to commercial applications. 1 This column reviews current and future applications of the additive manufacturing of ceramic materials as critical components in electronic devices, an industry in which small feature size is … [Read more...] about Additive Manufacturing for Electronics Applications

A New Chapter for PAMA: Strengthening the Future of Photopolymer Additive Manufacturing

05/29/2025 by becky

As I step into the role of chair of the Board for the Photopolymer Additive Manufacturing Alliance (PAMA), I find myself reflecting on the exciting opportunities that lie ahead for both PAMA and the photopolymer additive manufacturing industry. It’s a transitional time in the 3D-printing sector, full of challenges and opportunities. I am both honored and humbled to lead PAMA … [Read more...] about A New Chapter for PAMA: Strengthening the Future of Photopolymer Additive Manufacturing

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